Compact folded camera

ABSTRACT

Folded cameras comprising a movable lens having a lens optical axis and positioned in an optical path between an optical path folding element (OPFE) and an image sensor, wherein the OPFE folds light from a first direction to a second direction, the second direction being substantially along the lens optical axis, and an actuator for controlled lens movement, the actuator including or being attached to a shield partially surrounding the lens, the shield having an opening positioned and dimensioned to enable installation of the lens into the shield from an insertion direction substantially parallel to the first direction. A folded camera disclosed herein may be included together with an upright camera in a dual-camera.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/332,946 filed Mar. 13, 2019, which was a 371 application frominternational patent application No. PCT/IB2017/058403 filed Dec. 26,2017, and is related to and claims the benefit of U.S. Provisionalpatent application 62/445,271 filed Jan. 12, 2017, which is incorporatedherein by reference in its entirety.

FIELD

Embodiments disclosed herein relate in general to digital cameras and inparticular to thin folded optics cameras.

BACKGROUND

In recent years, mobile devices such as cell-phones (and in particularsmart-phones), tablets and laptops have become ubiquitous. Many of thesedevices include one or two compact cameras including, for example, amain rear-facing camera (i.e. a camera on the back side of the device,facing away from the user and often used for casual photography) and asecondary front-facing camera (i.e. a camera located on the front sideof the device and often used for video conferencing).

Although relatively compact in nature, the design of most of thesecameras is similar to the traditional structure of a digital stillcamera, i.e. it comprises a lens assembly (or a train of several opticalelements) placed on top of an image sensor. The lens assembly (alsoreferred to as “lens module” or simply “lens”) refracts the incominglight rays and bends them to create an image of a scene on the sensor.The dimensions of these cameras are largely determined by the size ofthe sensor and by the height of the optics. These are usually tiedtogether through the focal length (“f”) of the lens and its field ofview (FOV)—a lens that has to image a certain FOV on a sensor of acertain size has a specific focal length. Keeping the FOV constant, thelarger the sensor dimensions the larger the focal length and the opticsheight.

The assembly process of a traditional camera typically includes handlingof a few sub-assemblies: a lens, a sensor board sub-assembly and anactuator. The lens is typically made of plastic and includes a few (3-7)lens elements typically made of plastic or glass. The sensor boardsub-assembly typically includes the image sensor, a printed circuitboard (PCB) and electronics needed for the operation of the camera, asknown in the art. The actuator is used for several purposes: (1) itserves as a chassis for the camera, on which other parts are installed,(2) it is used to move the lens for optical needs, for example forfocusing and in particular auto focusing (AF) and/or optical imagestabilization (OIS), and (3) it is used for mechanical protection of theother parts of the camera. In known art, the lens is inserted andattached (e.g. glued) to the actuator from one side, along the lensoptical axis, whereas the sensor board is attached (e.g. glued) to theactuator from the opposite side along the optical axis.

Recently a “folded camera module” has been suggested to reduce theheight of a compact camera. In the folded camera module, an optical pathfolding element (referred to hereinafter as “OPFE”) e.g. a prism or amirror (otherwise referred to herein collectively as “reflectingelement”) is added in order to tilt the light propagation direction fromperpendicular to the smart-phone back surface to parallel to thesmart-phone back surface. If the folded camera module is part of adual-aperture camera, this provides a folded optical path through onelens assembly (e.g. a Tele lens). Such a camera is referred to herein as“folded-lens dual-aperture camera” or “dual-aperture camera with afolded lens”. In general, the folded camera module may be included in amulti-aperture camera, for example together with two “non-folded”(upright) camera modules in a triple-aperture camera.

A small height of a folded camera module (or simply “folded camera”) isimportant to allow a host device (e.g. a smartphone, tablets, laptops,smart TV) that includes it to be as thin as possible. The height of thecamera is limited many times by the industrial design. In contrast,increasing the available height for the lens, sensor and OPFE mayimprove optical properties. Therefore, there is a need for having afolded camera in which the height of the lens is maximal for a givencamera height, and/or the height of the image sensor active area ismaximal for a given camera height, and/or the height of OPFE is maximalfor a given camera height.

SUMMARY

Embodiments disclosed herein relate to thin folded cameras.

In various exemplary embodiments, there are provided folded camerascomprising a movable lens positioned in an optical path between an OPFEand an image sensor, wherein the OPFE folds light from a first directionto a second direction and wherein the lens has a lens optical axissubstantially parallel to the second direction and a lens heightsubstantially aligned with the first direction; a shield partiallysurrounding the lens and having a shield thickness, wherein the shieldis part of an actuator and includes top and bottom parts with respectivetop and bottom surfaces that lie in planes that are substantiallyperpendicular to the first direction, and wherein one of the shield topor bottom parts has a respective opening; and a lid having a first lidthickness and covering the opening in the shield, wherein the foldedcamera has a camera height substantially equal to a sum of the lensheight, the first lid thickness, the shield thickness, the size of afirst air gap between a first point on a surface of the lens facing thelid and the size of a second air gap being between a second point on asurface of the lens diametrically opposed to the first point and facingthe shield.

Note that as used hereinafter, the terms “top” and “bottom” refer tocertain positions/directions: “top” indicates a side of the foldedcamera or a component of the folded camera in a direction facing aphotographed object of interest (not shown), while “bottom” indicates aside of the folded camera or a component of the folded camera in adirection facing away from (opposite from) a photographed object ofinterest. In other words, the terms “top” and “bottom” refer topositioning of parts/elements/components lying in planes perpendicularto an axis 112 (see FIG. 1A below), where “top” is in a plane closer tothe object of interest for photography and “bottom” is in a planefurther away from the object of interest for photography than the topplane.

In an exemplary embodiment, the other of the top or bottom parts of theshield includes a respective second opening covered by a lid with arespective second lid thickness, the second air gap is between thesecond point and the second lid and the second lid thickness replacesthe shield thickness.

In an exemplary embodiment, each air gap is in the range of 10-50 μm. Inan exemplary embodiment, each air gap is in the range of 10-100 μm. Inan exemplary embodiment, each air gap is in the range of 10-150 μm.

In an exemplary embodiment, a folded camera further comprises a lenscarrier for holding the lens, the lens carrier having a V-groovestructure for mechanically positioning the lens in a correct positioninside the shield.

In an exemplary embodiment, the opening in the shield is dimensioned toenable insertion of the lens into the shield in a direction parallel tothe first direction and perpendicular to the lens optical axis.

In an exemplary embodiment, the image sensor is wire bonded to a printedcircuit board with wire bonds located on sides of the image sensor thatare substantially perpendicular to the lid and to the opposite surfaceof the shield.

In an exemplary embodiment, the movable lens is movable for focusing.

In an exemplary embodiment, the movable lens is movable for opticalimage stabilization.

In various embodiments, the folded camera has a height not exceeding thelens height by more than 800 μm. In an embodiment, the folded camera hasa height not exceeding the lens height by more than 700 μm. In anembodiment, the folded camera has a height not exceeding the lens heightby more than 600 μm.

In an exemplary embodiment, there is provided a folded camera comprisinga movable lens having a lens optical axis and positioned in an opticalpath between an OPFE and an image sensor, wherein the OPFE folds lightfrom a first direction to a second direction, the second direction beingsubstantially along the lens optical axis, and an actuator forcontrolled lens movement, the actuator including a shield partiallysurrounding the lens and having an opening positioned and dimensioned toenable installation of the lens into the shield from an insertiondirection substantially parallel to the first direction.

In an exemplary embodiment, a folded camera further comprises a lenscarrier for holding the lens, the lens carrier having a V-groovestructure for mechanically positioning the lens in a correct positionduring installation.

In an exemplary embodiment, there is provided a folded camera comprisinga lens positioned in an optical path between an optical path foldingelement and an image sensor, the lens having a lens height and anoptical axis, wherein the folded camera has a height not exceeding thelens height by more than 600 μm.

In an exemplary embodiment, there is provided a folded camera comprisinga lens positioned in an optical path between an OPFE and an imagesensor, wherein the OPFE folds light from a first direction to a seconddirection and wherein the image sensor is wire bonded to a printedcircuit board with wire bonds located on sides of the image sensor thatare substantially parallel to the first direction.

In various embodiments, a folded camera as above and as described belowis included together with an upright camera in a dual-camera.

In various exemplary embodiments, there are provided methods forassembling a folded camera, comprising providing an actuator for thefolded camera, the actuator having a shield, inserting a lens of thefolded camera into the actuator through an opening in the shield, thelens having a lens optical axis, inserting an OPFE into the actuator,wherein the OPFE folds light arriving from a first direction to a seconddirection, wherein the top surface of the shield faces the light fromthe first direction and wherein the lens optical axis is substantiallyparallel to the second direction, covering the shield opening with alid, and attaching an image sensor of the folded camera to the actuator.

In an exemplary embodiment, the covering the shield opening with a lidincludes fixedly attaching the lid to the shield.

In an exemplary embodiment, the opening is a top opening in the shield,and wherein the inserting the OPFE into the actuator includes insertingthe OPFE from a top surface of the actuator.

In an exemplary embodiment, the opening is a top opening in the shield,and wherein the inserting the OPFE into the actuator includes insertingthe OPFE from a bottom surface of the actuator.

In an exemplary embodiment there is provided a method for assembling afolded camera, comprising: providing an actuator for the folded camera,the actuator having a shield and a base separated into a back base partand a front base part; inserting a lens of the folded camera into theactuator through an opening in the shield, the lens having a lensoptical axis; inserting an OPFE into the actuator back base part,wherein the OPFE folds light arriving from a first direction to a seconddirection, wherein the top surface of the shield faces the light fromthe first direction and wherein the lens optical axis is substantiallyparallel to the second direction; attaching the back base part to thefront base part; covering the shield opening with a lid; and attachingan image sensor of the folded camera to the actuator.

BRIEF DESCRIPTION OF THE DRAWINGS

Non-limiting examples of embodiments disclosed herein are describedbelow with reference to figures attached hereto that are listedfollowing this paragraph. Identical structures, elements or parts thatappear in more than one figure are generally labeled with a same numeralin all the figures in which they appear. The drawings and descriptionsare meant to illuminate and clarify embodiments disclosed herein, andshould not be considered limiting in any way. In the drawings:

FIG. 1A shows describe an example of a folded camera disclosed herein;

FIG. 1B shows the folded camera of FIG. 1A separated into several partsand sub-systems or sub-assemblies;

FIG. 1C shows one embodiment of the actuator of the folded camera ofFIG. 1A with opposite lens and OPFE directions of insertion into theactuator;

FIG. 1D shows another embodiment of the actuator of the folded camera ofFIG. 1A with same lens and OPFE directions of insertion into theactuator;

FIG. 2A shows the lens of the folded camera of FIG. 1A in an isometricview;

FIG. 2B shows the lens of the folded camera of FIG. 1A in a longitudinalcross section;

FIG. 2C shows an embodiment of the lens of the folded camera of FIG. 1Ahaving top and bottom flat facets in a radial cross section;

FIG. 2D shows an embodiment of the lens of the folded camera of FIG. 1Awithout top and bottom flat facets in a radial cross section;

FIG. 3A shows an image sensor-PCB sub-assembly of the folded camera ofFIG. 1A in an exploded view;

FIG. 3B shows a rigid sensor PCB and an image sensor with wire bonds inthe image sensor-PCB sub-assembly of FIG. 3A;

FIG. 4A shows an exploded view of an actuator of the folded camera ofFIG. 1A;

FIG. 4B shows an electronic sub-system of the folded camera of FIG. 1Afrom one side;

FIG. 4C shows an electronic sub-system of the folded camera of FIG. 1Afrom another side;

FIG. 4D shows another embodiment of an actuator of the folded camera ofFIG. 1A;

FIG. 5A shows a longitudinal cross section of a complete folded cameraalong a cut A-A in FIG. 1A;

FIG. 5B shows a radial cross section of a complete folded camera along acut B-B in FIG. 1A;

FIG. 6 shows the internal structure of a driver integrated circuit forthe actuator;

FIG. 7 shows schematically an example of a dual-camera including afolded camera as in FIG. 1A and an upright camera;

FIG. 8A shows schematically steps in the assembly of a folded cameraaccording to an example embodiment;

FIG. 8B shows schematically steps in the assembly of a folded cameraaccording to another exemplary embodiment.

DETAILED DESCRIPTION

FIG. 1A shows an embodiment of a folded camera numbered 100 in anisometric view. An orthogonal X-Y-Z coordinate (“axis”) system shownapplies also to all following drawings. This coordinate system isexemplary. FIG. 1B shows camera 100 separated into several parts andsub-systems or sub-assemblies: a lens assembly (or simply “lens”) 102,an optical path folding element (OPFE) 104, an image sensor-PCBsub-assembly 106, an actuator 108 and a top lid 110. Top lid 110includes a section 110 a and a section 110 b, the latter having anopening 110 c. In some embodiments (such as in FIGS. 1A and 1B), section110 a and a section 110 b are part of a single plate (lid 110).

In some embodiments (such as in FIGS. 1C and 1D) section 110 a and asection 110 b are separate parts of lid 110. OPFE 104 folds an opticalpath along an axis 112 parallel to the Y axis (in the exemplarycoordinate system) from an object (not shown) into an optical path alongan axis 114 parallel to the Z axis (in the exemplary coordinate system).Axis 114 is the optical axis of lens 102. An image sensor 116 includedin sub-assembly 106 has a plane normal substantially aligned with axis114. That is, image sensor 116 lies in a plane substantiallyperpendicular to axis 114. FIG. 1C shows one embodiment of camera 100with opposite lens and OPFE directions of insertion into actuator 108,while FIG. 1D shows another embodiment of camera 100 with same lens andOPFE directions of insertion into actuator 108. As used herein withreference to a direction, “substantially” may refer to an exactalignment to the direction, or to a deviation of up to 0.5 degree, up to1 degree, up to 5 degrees or even to 10 degrees.

Top lid 110 is made for example of metal, e.g. a non-ferromagneticstainless-steel sheet, with typical thickness of 50-300 μm. Top lid 110is positioned on a top side of actuator 108, after the assembly ofactuator 108 and after the installation of lens 102 and OPFE 104 inactuator 108. Top lid 110 is close to touching the top surface of OPFE104 during installation (a nominal gap of 10-30 μm). Opening 110 c isdesigned such that light coming from an object will pass through it andreach OPFE 104.

Details of lens 102 are shown in and described with reference to FIGS.2A-2D. Details of sub-assembly 106 are shown in, and described withreference to FIGS. 3A-3B. Details of actuator 108 are shown in, anddescribed with reference to FIGS. 4A-C.

The height H of camera 100 is defined along the Y axis (direction ofaxis 112), from a lowermost end to an uppermost end, excluding a flexPCB 304 and a connector 306 (see below—FIG. 3B). H is an importantfigure of merit in commercial applications. Therefore, reducing H for agiven lens size to be as small as possible is a major design goal.Alternatively, maximizing the lens size for a given H is a major designgoal.

FIG. 2A shows lens 102 in an isometric view, FIG. 2B shows lens 102 in alongitudinal cross section, and FIGS. 2C and 2D show lens 102 in radialcross sections, respectively with and without flat facets on top andbottom external lens surfaces. Lens 102 includes several lens elements202 a-d (in general typically 3-8, with FIG. 2A showing as an examplefour), each lens element made for example of plastic or glass molding.Lens elements 202 a-d are held in a lens barrel 204, made for example ofplastic molding. A lens height (or “external diameter” in case of acylindrically shaped lens) 206 is defined as the distance along the Yaxis (or in the same direction as camera height H) from a lowermostpoint 206 a on an external surface of lens 102 to an upper-most point206 b on the external surface of lens 102. Typically, points 206 a-b arelocated on lens barrel 204, namely the height of lens 102 is limited bylens barrel 204. In some embodiments, at least one of lens elements 202a-d may extend outside of lens barrel 204. In such embodiments, theheight of lens 102 may be limited by one or more of elements 202 a-dand/or by lens barrel 204. An optical aperture 208 of lens 102 isdefined as the diameter of the opening in lens 102 toward the OPFE (104)side, as known in the art. Optical aperture 208 determines manyproperties of the optical quality of lens 102 and of camera 100, asknown in the art. The lens design is targeted to maximize opticalaperture 208 vs. the lens height. Lens 102 typically has a generalcylindrical shape, with a diameter larger than optical aperture 208 by,typically, 600 μm-2600 μm. In some embodiments, two flat facets 210 a-ban be provided in the external surface (envelope) of lens 102 on its topand bottom sides, such as to reduce lens height 206 by, typically,50-200 μm per facet, i.e. by a total of 100-400 μm. In such embodiments,the flat facets coincide with the lowermost and uppermost points 206a-b. The radial cross sections in FIGS. 2C and 2D show the lens with(FIG. 2C) and without (FIG. 2D) flat facets. The lens height (externaldiameter) reduction does not change the size of optical aperture 208.

FIG. 3A shows image sensor-PCB sub-assembly 106 in an exploded view.Sub-assembly 106 includes image sensor 116, a rigid sensor PCB 302, flexPCB 304, a connector 306, a bracket 308 and an IR filter 310. Imagesensor 116, typically made of silicon as known in the art, is firstmechanically attached (glued) and then electrically wire bonded to rigidsensor PCB 302. In order to minimize the camera height H and to maximizethe height (dimension along Y) of image sensor 116, wire bonds 312 onimage sensor 116 are located only on its two sides (along the Xdirection). The positioning of wire bonds 312 only to the sides of imagesensor 116 allows rigid sensor PCB 302 not to exceed camera height H, asdefined below. Thus, H can be minimized for a given PCB size or,alternatively, the PCB size can be maximized for a given H.

FIG. 3B shows rigid sensor PCB 302 and image sensor 116 with wire bonds312. Rigid sensor PCB 302 further includes four wiring pads 314 a-d,which are positioned next to wiring pads 452 a-d (FIG. 4C) to passelectrical signals to an IC driver 450 (FIG. 4B), as described below. Asknown, rigid sensor PCB 302 and flex PCB 304 may be made as one unit ina rigid-flex technology. Rigid sensor PCB 302 had rigid mechanicalproperties which allow mounting of sensor 116 and other optionalelectronic components such as capacitors, resistors, memory IC, etc.(not shown in the figures). Rigid sensor PCB 302 may have several(typically 2-6) metal (e.g. copper) layers and a thickness of 200 μm ormore. Flex PCB 304 has flexible mechanical properties, which allows itto bend such that the position of connector 306 does not increase theheight H of camera 100. Flex PCB 304 may have only two copper layers anda thickness of 50-100 μm. These and other fabrication considerations forrigid, flex and rigid-flex PCBs are known in the art.

Connector 306 is a board to board connector, as known in the art.Connector 306 is soldered to PCB 304 and allows sending and receivingdigital signals required for the operation of image sensor 116 and ICdriver 450 from the host device in which the camera is installed. Thehost may be for example a cell phone, a computer, a TV, a drone, smarteye glasses, etc.

Camera 100 has the ability to actuate (move) lens 102 along its opticalaxis 114 for the purpose of focusing or auto focusing (AF), as known inthe art. Focusing actuation is done using actuator 108, which isdescribed now in more detail with reference to FIGS. 4A-4C.

FIG. 4A shows an exploded view of actuator 108. Actuator 108 includes anactuated-sub assembly 402. Actuated-sub assembly 402 includes a lenscarrier 404, typically made of plastic, an actuation magnet 406 and asensing magnet 408. Magnets 406 and 408 can be for example permanentmagnets, made from a neodymium alloy (e.g. Nd₂Fe₁₄B) or asamarium-cobalt alloy (e.g. SmCo₅). Magnet 406 can be fabricated (e.g.sintered) such that it changes the magnetic poles direction: on thepositive Z side the north magnetic pole faces the negative X direction,while on the negative Z side the north-pole faces the positive Xdirection. Magnet 408 can be fabricated (e.g. sintered) such that itsnorth magnetic pole faces the negative Z direction. Magnets 406 and 408are fixedly attached (e.g. glued) to lens carrier 404 from the side (Xdirection). In other embodiments, magnets 406 and/or 408 may be attachedto lens carrier 404 from the bottom (negative Y direction). The magneticfunctions of magnets 406 and 408 are described below.

Lens carrier 404 houses lens 102 in an internal volume. Lens carrier 404has a top opening (or gap) 410 a, a bottom opening (or gap) 410 b, afront opening 410 c and a back opening 410 d. Top opening 410 a is madesuch that lens 102 can be inserted in (i.e. pass through) it during theassembly process. Openings 410 a and/or 410 b are designed such thatwhen lens 102 is located inside lens carrier 404 there are no otherparts between the lowermost and/or uppermost points (e.g. 206 a-b) inlens 102 and, respectively, a bottom lid 412 and top lid 110. Openings410 c and 410 d are dimensioned such that lens carrier 404 would notinterfere with light coming from the OPFE to the image sensor. That is,openings 410 c and 410 d are made such that (1) any ray of light comingfrom the OPFE and which would have reached sensor 116 through the lens102 if lens carrier 404 did not exist, will reach sensor 116 passingthrough openings 410 c-d, and (2) any ray of light coming from the OPFEand which would have not reached sensor 116 through the lens if lenscarrier 404 did not exist, will not reach sensor 116. In addition, insome embodiments, actuated sub-assembly 402 may be designed such thatthere is no point on actuated sub-assembly 402 higher than point 206 aand there is no point on actuated sub-assembly 402 lower than point 206b. This feature ensures that height H of camera 100 is limited only bylens height 206.

Actuator 108 further includes a base 420, made for example of plastic orof a liquid crystal polymer. Actuated sub-assembly 402 is suspended overbase 420 using two springs: a front spring 422 and a back spring 424.Springs 422 and 424 can be made for an example from stainless-steel orberyllium-copper. Springs 422 and 424 are designed such that they form alinear rail along the Z axis, namely that they have a low springcoefficient along the Z axis and a high spring coefficient in otherdirections: Y axis, X axis, and rotations around X, Y and Z axes. Usingtwo springs to create a linear rail is known in the art, however springs422 and 424 are designed such that their suspension point on base 420 ison one side (positive X axis) and their suspension point on lens carrier404 is on the other side (negative X axis). Furthermore, each of springs422 and 424 has an open circular part. The described design of springsallows to the following properties: (1) achieve desired linear railproperties; (2) the springs do not sacrifice optical properties ofcamera 100 by blocking any light coming from the OPFE to the imagesensor; (3) a spring does not reflect any ray of light coming from theOPFE or from lens 102 that it would arrive at the sensor; (4) none ofthe suspensions of springs 422 and 424 is along the Y axis, and therebyno additional height is needed or used for the suspensions; and (5) thesprings may withstand drop of the camera

In some embodiments, actuator 108 further includes integrally a shield430, typically made of a folded non-ferromagnetic stainless-steel sheet,with typical thickness of 100-300 μm. In other embodiments, camera 100may include a shield similar to shield 430 which is fixedly attached tocamera 100 and/or to actuator 108 at some stage of assembly. Regardlessof whether the shield is integral to the actuator or a separate partfixedly attached to the actuator, the description herein refers to theshield as being “part” of the actuator. Shield 430 surrounds base 420and actuated sub-assembly 402 on four sides, see also FIG. 1B. Somesections of the shield may have openings, while other may be withoutopenings. For example, an opening 431 in the top part of the shieldallows the installation of lens 102 in actuator 108. In someembodiments, top lid 110 and bottom lid 412 are the only parts that add(in addition to the lens) to camera height H. In some embodiments (as inFIG. 4A) bottom lid 412 is part of shield 430, while in otherembodiments, bottom lid 412 can be separated from shield 430. In someembodiments, shield 430 may have varying thicknesses, in the range givenabove, while the bottom lid 412 thickness is kept in the range of 50-200μm.

In camera 100, OPFE 104 is positioned in a back side 432 (negative Z) ofbase 420. FIG. 4D shows another embodiment of an actuator disclosedherein, numbered 108′. In actuator 108′, base 420 is separated into twoparts: a base back side 432 and a base back front side 433. In actuator108′, OPFE 104 is installed in-base back side 432, and then base backside 432 is attached (e.g. glued) to other parts of actuator 108′.

Actuator 108 further includes an electronic sub-system 440, FIG. 4Bshows electronic sub-system 440 from one side, and FIG. 4C showselectronic sub-system 440 from another side. Electronic sub-system 440includes actuator PCB 442, a coil 444 and a driver integrated circuit(IC) 450. Coil 444 and IC 450 are soldered to actuator PCB 442, suchthat coil 444 is connected electrically to IC 450 and IC 450 isconnected to four wiring pads 452 a-d on actuator PCB 442. Wiring pads452 a-d are used to deliver electronics signals to IC 450. Fourelectrical signals typically included operating voltage (Vdd), ground(Gnd) and two signals used for IIC protocol (signal clock (SCL) andsignal data (SDA)) as known in the art. In other embodiments, otherprotocols may be used, such as SPI protocol, known in the art, or IC 450may need more than one operating voltage to operate; is such cases theremay be more, or less, than 4 wiring pads, for example in the range of2-8. Actuator PCB 442 is glued to base 420 from the outside such thatcoil 442 and IC 450 pass through a hole 420 a in base 420, and such thatcoil 444 is positioned next to magnet 406, and IC 450 is positioned nextto magnet 408. The typical distance of coil 444 to magnet 406, and of IC450 to magnet 408 is in the range of 50-200 μm. This distance may allowactuated sub-assembly 402 to move along the Z axis without interference.In some embodiments, actuator 108 may work in an open-loop controlmethod, as known in the art, i.e. where a current signal is sent to thecoil without position control mechanism,

Coil 444 has exemplarily stadium shape, typically with a few tens ofwindings (e.g. in a not limiting range of 50-250) and with a typicalresistance of 10-30 ohm. Coil 444 is fixedly connected to IC 450,capable of sending input currents to coil 444. Current in coil 444creates a Lorentz force due to magnetic field of magnet 406: exemplary acurrent in a clockwise direction will create a force in the positive Zdirection, while a current in counterclockwise direction will create aforce in the negative Z direction. The full magnetic scheme (e.g. thepole direction of fixed magnet 406) is known in the art, and describedfor example in detail in patent application PCT/IB2016/052179.

FIGS. 5A and 5B show, respectively, cross sections of a complete camera100 along cuts A-A and B-B (FIG. 1A). Cuts A-A and B-B are respectivelyin Y-Z and X-Y planes. As shown in the cross section of FIG. 5B, lenscarrier 404 may further include a V-groove 504 in its bottom. V-groove504 allows pick-and-place mounting of lens 102 by insertion from topopening 410 a without the need of active alignment (see below).

In the embodiment shown in FIG. 5A and FIG. 5B, that height H of camera100 is equal to the height of lens 102+the thickness of bottom lid412+the thickness of top lid 110+two air gaps 510 a and 510 b. Air gaps510 a-b are dimensioned to allow motion of lens 102 without interferenceduring actuation. The motion of lens 102 is for focusing (and inparticular for auto focusing) along the Z axis and\or for OIS along theX direction; actuation modes for both AF and OIS are known in the art.For example, in some embodiments, each air gap 510 a or 510 b may belarger than about 10 μm, for example in the range 10-50 μm, 10-100 μm or10-150 μm. Thus, the structure of camera 100 maximizes the contributionof lens 102 to the total height of camera 100. In other embodiments, thecamera height may slightly exceed H, for example by up to 300 μm, due tothe OPFE or the image sensors having a height dimension slightly largerthan H. To summarize, in camera 100 the height H is no more than about600 μm above height 206 of lens 102. In this description, the use of theterms “about” or “substantially” or “approximately” with reference toheight or another dimension mean, in some embodiments, the exact valueof the height or dimension. In other embodiments, these terms mean theexact value plus a variation of up to 1% of the value, the exact valueplus a variation of up to 5% of the value, or even the exact value plusa variation of up to 10% of the exact value.

FIG. 6 shows the internal structure of IC 450. IC 450 includes a currentdriving circuit 602, exemplary an H-bridge, a position (e.g. PID)controller 604, an analog to digital converter (A2D) 606, a Hall barelement 608 and a user interface 610. Upon actuation, the relativeposition of actuated sub-assembly 402 and Hall bar element 608 ischanged. The intensity and direction of the magnetic field senses byHall bar element 608 is changed as well. The output voltage of Hallelement 608 is proportional to the magnetic field intensity. A2D 606converts the voltage level to digital numbers which are input toposition controller 604. Position controller 604 is used to control theposition of the actuated sub-assembly and set to the position commandsgiven by user in user interface 610. The control circuit output is theamount of current applied in coil 444. The full magnetic scheme (e.g.the pole direction of fixed magnet 408) is known in the art, anddescribed for example in detail in PCT patent applicationPCT/IB2016/052179.

The description of actuator 108 provided herein is only an example. Inother embodiments, the actuator may have a different guiding mechanism(for example a ball guided actuator as disclosed in co-owned patentapplication PCT/IB2017/054088), may include more actuation directions(for example an actuator including AF and OIS as disclosed inPCT/IB2017/054088), may have a different magnetic scheme (for example anactuator with magnetic reluctance magnetic scheme as disclosed inco-owned U.S. Pat. No. 9,448,382). In all such cases the actuator may bedimensioned/made/designed such that some or all of the followingproperties of camera 100 are preserved: (1) the height H is no more thanabout 600 μm above height 206 of lens 102; (2) the height H issubstantially equal to a sum of the lens height (206), the first lidthickness, the shield thickness, the size of a first air gap between afirst point on a surface of the lens facing the lid and the size of asecond air gap being between a second point on a surface of the lensdiametrically opposed to the first point and facing the shield; (3)there is no point on actuated sub-assembly 402 higher than point 206 aand there is no point on actuated sub-assembly 402 lower than point 206b.

FIG. 7 shows a dual-camera 700 that includes for example a camera suchas camera 100 as well as an upright camera 702, the latter known in theart. The operation of a dual-camera is known in the art, for example asdescribed in co-owned patent applications PCT/IB2015/056004 andPCT/IB2016/052179. Camera 702 is fixedly attached to camera 100 close toOPFE 104. In embodiment 700, the location of camera 702 is to thenegative Z side of folded camera 100, and the mechanical attachment isdone using a bracket 704, normally made from stain-less steel. In otherembodiments, camera 702 may be located on the negative or positive Xside of camera 100, for example as described in PCT/IB2016/052179. Inother embodiments camera 702 may be attached to camera 100 by other waysand means than by bracket 704.

Example of Folded Camera Assembly Process

In one embodiment, an example assembly process (method) for a foldedcamera described with reference to FIG. 8A may include, after a known inthe art assembly of an actuator such as actuator 108:

-   -   Step 1: Insertion of lens 102 into actuator 108 and attaching it        to lens carrier 404 from the top (Y direction, perpendicular to        optical axis 114) using e.g. a pick-and-place method. This can        be achieved because of top opening 431 left in shield 430 of        actuator 108 and opening 410 a left in lens carrier 404 of        actuator 108, and because of the mechanical structure of lens        carrier 404 and base 420. When inserting lens 102, air gap 510 b        is formed below lens 102 and above shield 430.    -   Step 2: Insertion of OPFE 104 into base 420 of actuator 108 from        the top (Y direction, perpendicular to optical axis 114) using        e.g. a pick-and-place method. This can be achieved because of        the mechanical structure of base 420.    -   Step 3: Fixedly attach top lid 110 to the top surface of shield        430. When fixing top lid 110, air gap 510 a is formed above lens        102 and below lid 110.    -   Step 4: Installation of image sensor-PCB sub-assembly 106.        Sensor 116 may be installed using two optional methods: (1) an        active alignment process or (2) a mechanical alignment process.        The two alignment processes allow setting the image sensor        perpendicular to optical axis 114 with different accuracy, as        known in the art.

The creation of air gaps 510 a, 510 b in respectively steps 1 and 3above allows motion of lens 102 relative to the other parts of camera100.

The assembly process above (steps 1-4) is relevant to a folded camera asin FIG. 1B and FIG. 5B. In some other embodiments, for example as inFIGS. 1C and 1D, the assembly process may include insertion of the OPFEfrom one side and insertion of the lens from the opposite side. In yetother embodiments, the insertion of the lens may be through a bottomopening (not shown) in a bottom surface of the shield opposite to thetop opening above, and the bottom opening is then further covered by abottom shield lid (not shown), which may have the same or similarthickness as the top lid.

In yet other embodiments with an actuator such as actuator 108′ wherethe base is separated into two parts, OPFE 104 may be installed fromother directions (top or front) in base back side 432. In this case,base back side 432 may be attached to actuator 108′ after the OPFE andlens installation in a step 2′ between steps 2 and 3 (FIG. 8B).

As used herein, the phrase “for example,” “such as”, “for instance” andvariants thereof describe non-limiting embodiments of the presentlydisclosed subject matter. Reference in the specification to “one case”,“some cases”, “and other cases” or variants thereof means that aparticular feature, structure or characteristic described in connectionwith the embodiment(s) is included in at least one embodiment of thepresently disclosed subject matter. Thus, the appearance of the phrase“one case”, “some cases”, “other cases” or variants thereof does notnecessarily refer to the same embodiment(s).

Unless otherwise stated, the use of the expression “and/or” between thelast two members of a list of options for selection indicates that aselection of one or more of the listed options is appropriate and may bemade.

It should be understood that where the claims or specification refer to“a” or “an” element, such reference is not to be construed as therebeing only one of that element.

It is appreciated that certain features of embodiments disclosed herein,which are, for clarity, described in the context of separate embodimentsor examples, may also be provided in combination in a single embodiment.Conversely, various features disclosed herein, which are, for brevity,described in the context of a single embodiment, may also be providedseparately or in any suitable sub-combination or as suitable in anyother described embodiment disclosed herein. Certain features describedin the context of various embodiments are not to be considered essentialfeatures of those embodiments, unless the embodiment is inoperativewithout those elements.

In embodiments of the presently disclosed subject matter one or moresteps illustrated in FIGS. 8A and 8B may be executed in a differentorder and/or one or more groups of steps may be executed simultaneously.

All patents and patent applications mentioned in this specification areherein incorporated in their entirety by reference into thespecification, to the same extent as if each individual patents andpatent application was specifically and individually indicated to beincorporated herein by reference. In addition, citation oridentification of any reference in this application shall not beconstrued as an admission that such reference is available as prior artto the present invention.

While this disclosure has been described in terms of certain embodimentsand generally associated methods, alterations and permutations of theembodiments and methods will be apparent to those skilled in the art.The disclosure is to be understood as not limited by the specificembodiments described herein, but only by the scope of the appendedclaims.

What is claimed is:
 1. A folded camera, comprising: a lens positioned in an optical path between an optical path folding element (OPFE) and an image sensor, wherein the OPFE folds light from a first direction to a second direction and wherein the image sensor is wire bonded to a printed circuit board (PCB) with wire bonds located on sides of the image sensor that are substantially parallel to the first direction.
 2. The folded camera of claim 1, wherein the folded camera has a height in the first direction and wherein the PCB has a PCB height in the first direction that does not exceed the folded camera height.
 3. The folded camera of claim 1, further comprising a lens positioned in the optical path between the OPFE and the image sensor, wherein the lens has a lens height and wherein the folded camera has a height not exceeding the lens height by more than 800 μm.
 4. The folded camera of claim 1, further comprising a lens positioned in the optical path between the OPFE and the image sensor, wherein the lens has a lens height and wherein the folded camera has a height not exceeding the lens height by more than 600 μm.
 5. The folded camera of claim 2, further comprising a lens positioned in the optical path between the OPFE and the image sensor, wherein the lens has a lens height and wherein the folded camera has a height not exceeding the lens height by more than 800 μm.
 6. The folded camera of claim 2, further comprising a lens positioned in the optical path between the OPFE and the image sensor, wherein the lens has a lens height and wherein the folded camera has a height not exceeding the lens height by more than 600 μm.
 7. The folded camera of claim 1, included together with a non-folded camera in a multi-aperture camera.
 8. The folded camera of claim 1, included together with another folded camera in a multi-aperture camera.
 9. The folded camera of claim 2, included together with a non-folded camera in a multi-aperture camera.
 10. The folded camera of claim 2, included together with another folded camera in a multi-aperture camera.
 11. The folded camera of claim 3, included together with a non-folded camera in a multi-aperture camera.
 12. The folded camera of claim 3, included together with another folded camera in a multi-aperture camera.
 13. The folded camera of claim 4, included together with a non-folded camera in a multi-aperture camera.
 14. The folded camera of claim 4, included together with another folded camera in a multi-aperture camera. 